 IC Chemical Processing Service
Bare die extraction/De-layer De-process/Staining/Micrography
IC Failure Analysis Service
Decapsulation/EMMI/OBIRCH/LC Hot spot/X-Ray/SAM
SEM/EDX/Positioned & Non-positioned IC Grinding/
Probe Station Application /Laser Cutting/De-gold Bump
FIB (Focused Ion Beam) Application
Micro-circuit Modification/Probing Pad Building/Cross-Section
ESD Test & Latch-upTest
Semicon Equipment Agency
ALLIED Metallographic Products
Semicon Equipment Maintenance Service |
